HARDENED FOR THE
CONTESTED EDGE
Circuit boards, ruggedized processors, and signal-intercept modules built for armored, naval, and unmanned platforms operating in denied environments.
THE ACQUISITION LANDSCAPE
HAS MATERIALLY CHANGED.
Three structural shifts are creating qualification gaps that legacy suppliers cannot close. Program managers who identify compliant subsystem partners early avoid schedule-risk exposure at CDR and PDR gates.
SHRINKING PRODUCTION TIMELINES
Program offices are compressing LRIP award-to-delivery windows from 36 months to under 18. Legacy EMS partners lack the certified stockpile and NPI velocity to absorb the schedule risk. Sentinel maintains pre-qualified buffer stock on all Tier-1 components with zero lead-time exposure on critical paths.
SWAP-C PRESSURE ACROSS PLATFORM CLASSES
Unmanned platforms and next-generation armored vehicles are demanding subsystems that deliver equivalent processing throughput at 30–40% reduced size, weight, and power envelopes. Standard commercial-off-the-shelf solutions fail at operational temperature ranges of −40°C to +85°C. Sentinel's ruggedized SBC line achieves Class-B thermal compliance at 280 g.
SUPPLY CHAIN RESHORING MANDATE
NDAA Section 2533 restrictions and DFARS clause 252.225-7001 are eliminating offshore-sourced semiconductors from DoD-funded programs. Primes face disqualification risk on existing contracts. Sentinel operates a domestic-only supply chain with full country-of-origin traceability to the die level, ITAR-registered and CMMC Level 2 certified.
QUALIFIED SUBSYSTEMS
BY PLATFORM CLASS
Ruggedized Single-Board Computer
MIL-spec SBC with Intel Xeon-D architecture, designed for armored vehicle C2 systems requiring full Class-B thermal compliance.
Wideband Signal-Intercept Module
Multi-channel RF intercept module covering 20 MHz–18 GHz, optimized for naval EW suites and shipboard intelligence collection platforms.
Hardened Circuit Board — UAV Class
Ultra-low SWAP compute module for Group 3–5 UAS platforms. Conformal-coated, vibration-isolated, with native MIL-STD-1553B and ARINC 429 bus interfaces.
Neural Processing Unit — Edge Inference
Tactical-edge AI inference accelerator for autonomous target recognition and sensor fusion aboard armored and airborne platforms.
Ruggedized Power Management Module
Multi-rail power conditioning and management module for shipboard and vehicle applications. Handles 28 VDC military vehicle bus and 115 VAC 400 Hz aircraft power.
Fiber-Optic Communications Module
High-bandwidth fiber-optic interface card enabling jam-resistant intra-platform networking aboard next-generation armored vehicles and naval combatants.
MISSION BRIEFS
OPERATIONAL PROOF AT PROGRAM SCALE
Unclassified program summaries formatted for engineering review board distribution. Full technical data packages available under NDA upon qualification.
NEXT-GEN IFV COMPUTE MODERNIZATION
Prime contractor faced a 14-month LRIP delivery window for 840 ruggedized compute nodes. Legacy supplier disqualified under NDAA Section 2533 at T−8 months. Re-sourcing risk threatened CDR milestone and $2.4B program value.
Sentinel activated pre-certified SCB-400 stockpile with zero NPI lag. Full MIL-STD-810H re-qualification package delivered in 6 weeks. DFARs country-of-origin documentation completed in parallel.
CDR milestone preserved. First article delivery achieved at T+11 months. No schedule slip. Program manager cited Sentinel as "only vendor with the stockpile and qual documentation to close the gap."
DESTROYER EW SUITE UPGRADE
Twelve-hull DDG-51 Flight III EW suite upgrade required wideband signal-intercept modules compliant with MIL-STD-461G Class B1 shipboard EMI limits. COTS RF modules failed saltwater corrosion testing at 500-hour mark. Program 9 months from IOC.
SIM-700 deployed with conformal coating, hermetically sealed connectors (MIL-DTL-38999), and shipboard-grade vibration isolation. Full 1,000-hour salt-fog qualification completed under Navy TEMPEST protocol.
IOC milestone met on schedule across all 12 hulls. Zero field failures at 18-month mark. NAVSEA engineering review board approved SIM-700 as the baseline for DDG-51 Block II production.
READY TO CLOSE
THE QUALIFICATION GAP?
Sentinel's technical brief library contains full qualification packages, SWAP-C comparison data, and production timeline documentation — formatted for engineering review board distribution. Access requires a .mil or corporate domain email.
Gated access to qualification packages, datasheet PDFs, and SWAP-C comparison matrices. Immediate download upon verification.
60-minute session with a Sentinel program engineer. For primes and MoD procurement officers with active RFP or RFI in progress.